Posted in | News | Packaging Automation

Rockwell Automation Sponsors Sessions on Production Improvement Technologies at PACK EXPO 2013

Attendees at this year’s PACK EXPO 2013 can learn firsthand about innovative technologies to improve production – such as line integration, cloud computing and mobility on the plant floor – in classroom sessions sponsored by Rockwell Automation and its PartnerNetwork program in Las Vegas, Sept. 23 to 25.

The Center for Trends and Technology (CTT) (Booth 1358 in the Central Hall), hosted by the Packaging Machinery Manufacturers Institute (PMMI), will feature speakers and displays from leading technology companies, including Cisco, Endress+Hauser, Jacobs Automation, Microsoft, Motorola, Panduit, ProSoft Technology Group and Spectrum Control.

During each day of the event, manufacturers in food, beverage, life sciences, pharmaceuticals, and household and personal care can attend five one-hour classroom sessions aimed at helping them achieve higher productivity, efficiency and sustainability. Topics covered will include network security, manufacturing convergence, safety, packaging-line integration, energy management, remote asset management, mobility, cloud computing and robotics integration.

“Consumer packaged goods manufacturers face a number of challenges as they work to remain profitable while accommodating ever-changing consumer health, taste and cost preferences,” said Mike Wagner, manager, Global Packaging Business at Rockwell Automation. “Our goal with the educational sessions and displays in the CTT is to arm manufacturers with an understanding of new and emerging technologies, and demonstrate how to use them to solve unique production challenges. In addition, the CTT will spark collaboration among manufacturers, OEMs and technology leaders alike, keeping them at the forefront of their industry.”

With more than 1,600 exhibitors and an expected 26,000 attendees, PACK EXPO Las Vegas will be North America’s most comprehensive resource of the year for packaging and processing innovation.

Among those exhibiting will be a wide variety of OEM Partners, whose innovative machines feature the Rockwell Automation integrated control and information platform, including: Aagard, AFA Systems, ARPAC Group, Bradman Lake Group, Cavanna Packaging Group, Columbia Machine, Delkor Systems, Douglas Machine, Intelligrated, Nercon, NJM Packaging, Osgood Industries, Pearson Packaging Systems, R.A. Jones, Schneider Packaging Equipment, Triangle Package Machinery, vonGAL and Wulftec International. To find an OEM Partner or learn more about the OEM Partner program, visit: http://www.rockwellautomation.com/sales-partners/oem-partners/overview.page.

About the Rockwell Automation PartnerNetwork Framework
The Rockwell Automation PartnerNetwork framework offers global manufacturers access to a collaborative network of companies mutually focused on developing, implementing and supporting best-in-breed solutions to achieve plantwide optimization, improve machine performance, and meet sustainability objectives.

About Rockwell Automation
Rockwell Automation Inc. (NYSE: ROK), the world’s largest company dedicated to industrial automation and information, makes its customers more productive and the world more sustainable. Headquartered in Milwaukee, Wis., Rockwell Automation employs over 22,000 people serving customers in more than 80 countries.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Rockwell Automation, Inc.. (2019, February 20). Rockwell Automation Sponsors Sessions on Production Improvement Technologies at PACK EXPO 2013. AZoRobotics. Retrieved on November 22, 2024 from https://www.azorobotics.com/News.aspx?newsID=4398.

  • MLA

    Rockwell Automation, Inc.. "Rockwell Automation Sponsors Sessions on Production Improvement Technologies at PACK EXPO 2013". AZoRobotics. 22 November 2024. <https://www.azorobotics.com/News.aspx?newsID=4398>.

  • Chicago

    Rockwell Automation, Inc.. "Rockwell Automation Sponsors Sessions on Production Improvement Technologies at PACK EXPO 2013". AZoRobotics. https://www.azorobotics.com/News.aspx?newsID=4398. (accessed November 22, 2024).

  • Harvard

    Rockwell Automation, Inc.. 2019. Rockwell Automation Sponsors Sessions on Production Improvement Technologies at PACK EXPO 2013. AZoRobotics, viewed 22 November 2024, https://www.azorobotics.com/News.aspx?newsID=4398.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.