CyberOptics to Demonstrate Final Version of WaferSense Airborne Particle Sensor

CyberOptics will be giving a demonstration of the final production version of the WaferSense Airborne Particle Sensor (APS) at Semicon, which will be held in Japan during 5 to 7 December.

Apart from the APS, CyberOptics will be giving a demonstration of the complete line of WaferSense wireless metrology devices at the international show.

The WaferSense APS provides superior performance when compared to the conventional static airborne particle sensors. The limitations of the conventional sensors such as the static output and limited reach are eliminated with the WaferSense APS. The APS goes through the entire semiconductor process for counting and identification of the particles real time. The semiconductor process in APS minimises the time and also the expense related to the particle identification process. Using the APS for airborne particle identification improves the die yield and also the final wafer inspection process. Fabs are provided for isolating and mitigating the source of the particles by using a tool before the wafer processing begins. The sensor is used to identify and classify the air particles along with their sources while the wafers are transferred, split valves actuate and cycling, flushing out and pumping of chambers. The process engineers are provided with real-time views of the particles and be able to identify trouble spots and plan the particle qualifications at the initial stages itself. The APS is available in sizes of 200, 300 and even 450 mm having form factor like wafers.